31
Mar
2021
Paper Submission Deadline
30
Dec
2021
Publishing Date

Add to Calendar 03/31/2021 08:00 Europe/Rome Latest Advances in Grinding Technology

This Special Issue on the Latest Advances in Grinding Technology will highlight state-of-the-art advances in grinding technology. It is known that the grinding manufacturing process is the most expensive and costly operation in manufacturing; it is an operation that is difficult to avoid with respect to the manufacturing of hard materials and in the production of complex three-dimensional shapes. This Special Issue will cover the following avenues: The use of nanotechnology in grinding operations; The use of neural networks and artificial intelligence in optimizing the grinding process; The use of ultrasound wave technology during the process of grinding; The new techniques in dressing operations for expensive diamond and other highly advanced grinding wheels; The latest techniques and investigations in coolant usage and operations; Ultra-precision grinding operations; Latest techniques for in-process grinding monitoring to achieve high-precision, high-efficiency, and low-cost operations; Optical and aero-mechanical profiling of grinding surface topography profiling; Process modeling and theoretical background of the heat transfer aspects of the grinding process.
Keywords: Ultra-precision Grinding; Nanotechnology in grinding operation; Surface profiling techniques; In-process grinding monitoring operations; Artificial intelligence usage in grinding-process modeling techniques.

Switzerland
CALL FOR PAPERS
Code: CFP-JM&MP109-SI1-2021
Posting date: 07/11/2020

Latest Advances in Grinding Technology


Aims and Scope

This Special Issue on the Latest Advances in Grinding Technology will highlight state-of-the-art advances in grinding technology. It is known that the grinding manufacturing process is the most expensive and costly operation in manufacturing; it is an operation that is difficult to avoid with respect to the manufacturing of hard materials and in the production of complex three-dimensional shapes. This Special Issue will cover the following avenues: The use of nanotechnology in grinding operations; The use of neural networks and artificial intelligence in optimizing the grinding process; The use of ultrasound wave technology during the process of grinding; The new techniques in dressing operations for expensive diamond and other highly advanced grinding wheels; The latest techniques and investigations in coolant usage and operations; Ultra-precision grinding operations; Latest techniques for in-process grinding monitoring to achieve high-precision, high-efficiency, and low-cost operations; Optical and aero-mechanical profiling of grinding surface topography profiling; Process modeling and theoretical background of the heat transfer aspects of the grinding process.
Keywords: Ultra-precision Grinding; Nanotechnology in grinding operation; Surface profiling techniques; In-process grinding monitoring operations; Artificial intelligence usage in grinding-process modeling techniques.

Languages
English
Country
Switzerland
Topics
Advanced Materials, Artificial Intelligence, Automation, Cost-Benefit Analysis, Data Analysis Processes, Data Management, Decision Support Systems, Digital Fabrication, Digital Technologies, Future Developments, Human-computer Interface, ICT, Industrial Engineering, Industry 4.0, Innovative Techniques, Innovative Technologies, Internet of Things (IoT), Life Cycle Assessment (LCA), Manufacturing & Machinery, Manufacturing Systems, Modeling, Nanotechnology, Performance-based Design, Process Innovation, Process Management, Process Modeling and Simulation, Production, SDGs 2030, Simulation Tools, Waste Management
Review process
The Journal adopts double-blind peer review process
Indexed By

Chemical Abstracts (ACS), DOAJ, Emerging Sources Citation Index-Web of Science (Clarivate Analytics), Inspec (IET), Norwegian Register for Scientific Journals, Series and Publishers (NSD), Scopus (Elsevier), Web of Science (Clarivate Analytics), CLOCKSS (Digital Archive), e-Helvetica (Swiss National Library Digital Archive), Academic OneFile (Gale/Cengage Learning), EBSCOhost (EBSCO Publishing), Google Scholar, J-Gate (Informatics India), ProQuest Central (ProQuest), Science In Context (Gale/Cengage Learning).

APC

Info at: www.mdpi.com/journal/jmmp/apc

Submit by website
Call webpage
Additional Notice from the Editor

Guest Editor
Dr. Talal Maksoud